
Faisal Ahamed – Senior Principal Test Development Engineer
About Me
Experienced engineer with 15+ years in Test Development and Product Engineering in the semiconductor industry. Proven track record in RF characterization, load board design, and new product introduction (NPI). Certified Six Sigma Green & Black Belt.
Work Experience
- Architected dc load board design... honored with multiple TEA awards.
- Led a diverse team... reducing customer quality complaints by 50%.
- Coordinated multi-functional team for Macro GAN NPI... $200M revenue.
- Spearheaded NTI/NPI product... USD 100 million in sales.
- Engineered first PLD package... reducing test time by 25%.
- Launched top cooling heatsink package... USD 68 million socket win.
- Championed test program development... USD 120 million revenue.
- Introduced 50+ NPIs... significant revenue growth.
- Resolved customer quality issue on Silicon Germanium... USD 40 million revenue.
- Resolved oscillation complaint... USD 40 million in 2005.
- Integrated load board... USD 23 million in 2005.
- Implemented DC Check... reduced downtime to nil.
- Innovated RF test time reduction... 2x throughput.
- Characterized wafer fab thickness... yield to 99%.
- Eliminated DC leaking... initiated Bronze Medal in 2010.
- Improved yield... cost saving USD 250K annually.
- Developed pristine DC board... improved VDs accuracy by 50%.
- Overhauled symmetrical lead shorting... Bronze Medal in 2011.
- Improved RFIC Platform yield... $400K annual savings.
- Enhanced HPA test capability... USD 200 million revenue.
- Revamped MHPA18010... $250 million revenue, DMADV certification.
Independant/Carrier Break, Kuala Lumpur, Malaysia
Senior Staff Test/Product Development Engineer(Open to Opportunities) – March 2024 to Present
NXP Malaysia Sdn Bhd, Petaling Jaya, SGR, Malaysia
Senior Staff Test/Product Development Engineer – January 2016 to March 2024
Freescale Semiconductor Malaysia Sdn Bhd, Petaling Jaya, SGR, Malaysia
Staff Product Engineer – January 2004 to December 2015
Motorola Malaysia Sdn Bhd, Petaling Jaya, SGR, Malaysia
Senior Product Engineer – January 2000 to December 2003
CEO Award
These awards were presented by 3 different company’s CEOs for outstanding demonstration utilizing statistical tools and yield optimization.
- Six Sigma BlackBelt Certification CEO Award.
- Six Sigma GreenBelt Certification CEO Award.
- Diamond Chip CEO Award.
Six Sigma Black Belt

Six Sigma Green Belt

CEO Diamond Award

Peer To Peer Award
These prestigious award was presented by Chandler USA Product Team for outstandinng collabration between sites.

Bravo Award
These awards were presented by favctory general Mamager for outstanding individual contribution yield improvement.

Silver Awards
This section includes factory-level TEA silver medal certification awards and plagues.
- MD7IC2050 New DC load Board Development with 4 Point Kelvin System 2011-Silver Medal.
- Integrated Load Board Design MW6IC2240/MW6IC2015 in 2005- Silver Medal.
- MHPA18010 PA Recharacterization in 2004 -Silver Medal.
MD7IC2050N New DC Load Board Design, Developent And Implementation Using DMADV



Intergrated FET Tester DC Load Board Design and Development-MW6IC2015/MW6IC2240 Using DMAIC Approach


MHPA18010 NPI Design Optimization Using DMAIC Approach


Bronze Awards
This section includes factory-level TEA bronze medal certification awards and plagues.
- Triseca NTI package 14x10mm test hardware solutions and development with USD68 million life time revenue in 2023-Bronze Medal.
- Both Delta 1688 handler and Turret Handler integration to Juno DC tester thru dc interface board in 2017- Bronze Medal.
- AFT20S015N Poka Yoke Solution for Wrong Oreintation Detection in 2015-Bronze Medal.
- New Juno Tester DC Interface Design For Entire TO platfom in 2015-Bronze Medal.
- Gross Margin improvement for RFIC Platform in 2013- Bronze Medal.
- Total Factory Wire Bond Quality Improvement in 2013-Bronze Medal.
- Error Proof MR6VP3091 adjacent lead shorting test excursion to customer in 2011-Bronze Medal.
- L15 Yield Improvement Black belt Project using DMAIC approach in 2010-Bronze Medal.
- Elimination of Ruptured DC blocking Cap Escape to Customer-MD7IC2050N in 2010-Bronze Medal.
- M52A die mask Series Capacitance Nitride Thickness to RF Performance Characterization in 2008 -Bronze Medal.
- RF test time improvement using innovative method in 2006 -Bronze Medal.
- Fool Proof Burnt Circuit Elimination Thru RF Software Optimization in 2006- Bronze Medal.
- MW4IC2230 Customer JRC Oscillation Complaint in 2005 -Bronze Medal.
- HPA Next Generation Module in 2003 -Bronze Medal.
NTI Pristine RF Triseca DC Test Solution



Delta 1688(PQFN 8x8)DC Test Solution Development Using DMAIC Apporach



AFT20S015N EOS Elimination Utilizing Poka-Yoke Methodolgy



New DC Tester Interface Design And Development For TO Platform



Gross Margin Improvement On 2Ghz RFIC Devices



KLM Wire Bond Quality Metrics Improvement



Error Proof DC Load Board Design Solution For RF Plastic Packages



Elimination Of Test Fault-Grading Escapees-MD7IC2050N



L15 DC Test Yield Improvement Thru DMADV Appprach
Six Sigma Blackbelt Project


M52A Yiled Improvemnt


Test Time Reduction For RFIC Platform Using DMAIC Approach


Fool Proof RFIC Ciecuit Protection Through Software Development Using DMAIC Approach


MW4IC2230 Custmoer JRC Oscillation Fix


Next Generation HPA Module Platform Development


External Certificates
This section includes extrenal certification awarded by outside NXP.
- C++ Certification.
- Effective Communiation Skills Hub Training.
- Cassini Basic System Training Seminar by Roos Instruments.
- NI Labview Code Developer Certification
C++ Certification.

Effective Communiation Skills Hub Training.

Cassini Basic System Training Seminar by Roos Instruments.

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NI Labview Code Developer Certification.

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Internal Certificates
This section includes intrenal certification awarded by within NXP.
- RF Innovation Award.
- Anti-Mix Prevention Factory Level Workshop Kaizen.
- FMEA(Failure Mode And Effects) Analysis.
RF Innovation Award.

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Anti-Mix Prevention Factory Level Workshop Kaizen.

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FMEA(Failure Mode And Effects) Analysis.

Contact
Email: faisalking3rd@gmail.com
LinkedIn: linkedin.com/in/faisal-ahamed
Location: Kuala Lumpur, Malaysia